Solder Paste is an important component that assists in holding electronic components in place on the PCB board.
Solder Paste is used to create electrical connections and mechanical bonds between printed circuit board pads and surface mount devices.
Typically it is made up of powdered solder in a flux paste. The flux has several important roles to play. These include:
There are a number of factors that affect the performance of solder paste. These include:
A wide majority of PCB circuit board failures occur on account of issues related to the solder paste process. Hence extreme caution is required when it comes to its application. Particularly as electronic devices get smaller, precision placement becomes increasingly critical. While high-speed pick and place equipment can accurately place components, if the soldering process isn’t carefully done, it affects the efficacy of the final device. A solder paste that is too thick or that is not applied right will lead to a poor connection. Solder paste applied in excess can also result in bridge shots, while if it is too light it will lead to inferior connections.
Based on its flux type, solder can be classified into 3 broad types as below:
Rosin based solder pastes
This paste is made from a natural extract from pine trees. It is possible to clean these fluxes after the soldering process with the help of a solvent.
No clean solder pastes
Made of resins and solid residues, these pastes are preferred on account of the fact that they are low on the following:
However, such pastes need an extremely clean assembly environment.
Water soluble flux solder pastes
They are made up of organic materials and gycol bases and have a number of cleaning agents.
Some of the important properties of solder pastes include:
Viscosity – Simply put, it is the tendency to flow. If the metal content increases, the viscosity goes up. Similarly, viscosity has a strong correlation with temperature.
Slump – Slump refers to the spreading of the material after application. Slump largely depends upon:
Rheology- Rheology determines the flow of solder paste under certain conditions. Rheology also impacts the print quality of the paste.
Solder paste finds extensive application in the following processes:
There are a number of aspects to take into account to ensure that there are no errors in the application of solder paste. These include:
Solder pastes inspection and its application are the key steps in PCB operations as they can reduce defects. An accurately applied high-quality solder paste will ensure that the board and the final device work accurately.
At Technotronix, we are fully equipped to handle your PCB manufacturing requirements. We have over 40 years of experience in SMT PCB assembly. Our team of experts and state-of-the-art manufacturing facilities ensure that all our PCBs meet industrial standards. If you are looking for high-quality SMT PCB solutions, you can submit your requirements via PCB SMT assembly quote form.
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