When it comes to electronic assembly, surface finish of the PCB is one of the most crucial decisions that you could take. Surface finish, in turn has implications on a whole lot of issues, including but not limited to:
Selection of the surface finish must be done basis a whole range of factors. Sometimes the mistake that is made, is to go by costs alone. While in the short run you may seem to be saving costs, you could be in for a rude shock in the long term.
OSP, however, isn’t recommended in cases where:
Since tarnish is an issue, perception of quality often emerges as an issue with this surface finish.
However, in cases where wire bonding is required or lead-free wave solder is needed it is best not to go in for this surface finish. It is also not a very popular choice with USA based PCB Manufacturer as it comes with a host of environmental and health concerns.
The use is this surface finish is rampant where:
Clearly, however, this surface finish will not fit your bill if:
This surface finish is the first choice for PCB Manufacturer California, where:
In case of high volume requirements or where wire bonding is required, this isn’t a preferred surface finish.
As the above charts reveal, choosing the right finish is a fairly technical task. PCB manufacturers with experience and industry expertise are best suited to choose the right surface finish, which in turn has a lot of implication on the overall success or failure of the electronics assembly. Some of the industries where these finishes typically see a lot of application, include:
Sometimes, however, the decision of the surface finish is taken erroneously based on:
Each of these approaches can have long-term consequences and need to be avoided in isolation.
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